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Cutting sapphires

One of the core competences of LASAG is the cutting of sapphires. As a result of its optical and mechanical characteristics, this crystal is in high demand in the electronics and watch industry, for example. However, the processing of sapphires represents a challenge. The cut edge should be crack, chip, and oxide-free. The roughness of the cut surface should be kept to a minimum.

With the LASAG laser LFS, you can achieve cut surfaces with a roughness of Ra 0.8 to 1.5 µm and chipping of <10 µm.